Manufacturer Part #
AT42QT2160-MMUR
AT42QT2160 Series 16 Channel 5.5 V 1.127 mA QMatrix Touch Sensor IC - VQFN-28
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:6000 per Reel | ||||||||||
| Date Code: | |||||||||||
Microchip AT42QT2160-MMUR - Product Specification
Shipping Information:
ECCN:
PCN Information:
NOTICE WITHDRAWALPCN Status: Cancellation of notification.Reason for Change:Microchip has decided to not qualify NSEB as a new assembly site for selected Atmel products available in 28L VQFN (4X4X1mm) package with MSL 1 classification.Revision History:January 13, 2021: Issued initial notification.February 2, 2022: Issued cancellation notification.
PCN Status: Initial notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of NSEB as a new assembly site for selected Atmel products available in 28L VQFN (4X4X1mm) package with MSL 1 classification.Pre Change: Assembled at ASKR assembly site using palladium coated copper (PdCu) bond wire or gold (Au) bond wire, EN-4900GC die attach material, with PPF or Matte Sn lead plating finish, Ring plating DAP Surface Prep, without lead-lock lead frame and MSL 1 / MSL 3 classification.Post Change:Assembled at NSEB assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach material with Matte Sn lead plating finish, Ag on lead only DAP Surface Prep and with lead-lock lead frame and MSL 1 classification.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve productivity by qualifying NSEB as a new assembly site.Change Implementation Status:In Progress Estimated Qualification Completion Date:July 2021Method to Identify Change: Traceability codeQualification Plan:Please open the attachments included with this PCN labeled as PCN_#_Qual_Plan. Revision History:January 13, 2021: Issued initial notification.
Part Status:
Available Packaging
Package Qty:
6000 per Reel