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Référence fabricant
MIC2194YM-TR
MIC2194 Series 14 V 440 kHz Surface Mount PWM Buck Controller IC - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2500 par Reel Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC2194YM-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Product Change Notification / LIAL-24KOXB344PCN Status:Final notification. PCN Type: Manufacturing ChangeDescription of Change: Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site.Pre Change: Using CPAK carrier tape, cover tape and plastic reel materialPost Change:Using CPAK carrier tape, cover tape and plastic reel material or 3M carrier tape and cover tape material or U-PAK carrier tape and cover tape material and LPP plastic reel material.Impacts to Data Sheet:None Change Impact:None Reason for Change:Due to unforeseen business conditions and to improve on-time delivery performance, Microchip has qualified 3M and UPAK as an additional cover tape and carrier supplier and LPP as additional reel supplier at STAR assembly site effective immediately.Change Implementation Status:In Progress Estimated First Ship Date:December 2, 2020 (date code: 2049)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
PCN Status:Final notification. PCN Type: Manufacturing ChangeDescription of Change: Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site.Pre Change: Using CPAK carrier tape, cover tape and plastic reel materialPost Change:Using CPAK carrier tape, cover tape and plastic reel material or 3M carrier tape and cover tape material or U-PAK carrier tape and cover tape material and LPP plastic reel material.Pre and Post Change Summary:NOTE: See attached Packing Pre and Post Changes for the changes of the following. Impacts to Data Sheet:None Change Impact:None Reason for Change:Due to unforeseen business conditions and to improve on-time delivery performance, Microchip has qualified 3M and UPAK as an additional cover tape and carrier supplier and LPP as additional reel supplier at STAR assembly site effective immediately.Change Implementation Status:In Progress Estimated First Ship Date:December 2, 2020 (date code: 2049)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Description of Change:Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site.Pre Change: Using CPAK carrier tape, cover tape and plastic reel material.Post Change:Using CPAK carrier tape, cover tape and plastic reel material or 3M carrier tape and cover tape material or U-PAK carrier tape and cover tape material and LPP plastic reel material.Reason for Change:Due to unforeseen business conditions and to improve on-time delivery performance, Microchip has qualified 3M and UPAK as an additional cover tape and carrier supplier and LPP as additional reel supplier at STAR assembly site effective immediately.Estimated First Ship Date:December 2, 2020 (date code: 2049)
Statut du produit:
Microchip MIC2194YM-TR - Caractéristiques techniques
| Supply Voltage: | 2.9V to 14V |
| Frequency-Max: | 440MHz |
| Input Current: | 2mA |
| Input Voltage: | 14V |
| Topology: | Buck/Boost |
| Rated Power: | 285mW |
| Duty Cycle-Max: | 100% |
| Storage Temperature Range: | -65°C to +150°C |
| Thermal Resistance: | 140°C/W |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2500 par Reel
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount