Référence fabricant
24LC00-I/SN
24LC00 Series 128 Bit I2C 2 Wire (16 x 8) 2.5 V Serial EEPROM SMT - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2252 | ||||||||||
Microchip 24LC00-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Microchip 24LC00-I/SN - Caractéristiques techniques
| Memory Density: | 128b |
| Memory Organization: | 16 x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 4ms |
| Data Retention: | 200 yr |
| Interface Type: | I2C |
| Access Time-Max: | 3500ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The 24LC00 series of 128-bit Electrically Erasable PROM memory organized as 16 x 8 with a 2-wire serial interface. Low-voltage design permits operation down to 1.7 volts for the 24AA00 version, and every version maintains a maximum standby current of only 1 μA and typical active current of only 500 μA.
This device was designed for where a small amount of EEPROM is needed for the storage of calibration values, ID numbers or manufacturing information, etc. The 24XX00 is available in 8-pin PDIP, 8-pin SOIC (3.90 mm), 8-pin TSSOP, 8-pin 2x3 DFN and the 5-pin SOT-23 packages.
Features:
- Single supply with operation down to 1.7 V for 24AA00 devices, 2.5 V for 24LC00 devices
- Low-power CMOS technology: - Read current 500 μA, typical - Standby current 100 nA, typical
- 2-wire serial interface, I2C™ compatible
- Schmitt Trigger inputs for noise suppression
- Output slope control to eliminate ground bounce
- 100 kHz and 400 kHz clock compatibility
- Page write time 3 ms, typical
- Self-timed erase/write cycle
- ESD protection >4000 V
- More than 1 million erase/write cycles
- Data retention >200 years
- Factory programming available
Learn more about the 24LC00 family of EEPROM
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount