Efinix — Titanium Ti375 FPGAs | Futureelectronics NorthAmerica Site
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Efinix

 

Efinix Titanium Ti375 FPGA Device and Development Kit

Features the high-density, low-power Efinix® Quantum® compute fabric wrapped with an I/O interface

The Ti375 FPGA by Efinix features the high-density, low-power Efinix® Quantum® compute fabric wrapped with an I/O interface. This FPGA has a variety of features, such as a hardened RISC-V block, SerDes transceiver, LPDDR4/4x DRAM controller, and MIPI D-PHY.

The quad-core hardened RISC-V block has a 32-bit CPU featuring the ISA RISCV32I with M, A, C, F, and D extensions, and six pipeline stages. You utilize the hardened RISC-V block by instantiating the Sapphire High-Performance SoC, combining the speed and efficiency of a hardened RISC-V block with the flexibility of peripherals in soft logic.

The full-duplex SerDes transceiver supports multiple protocols including PCIe 4.0, Ethernet SGMII, and Ethernet 10GBase-KR protocols as well as a PMA Direct mode with data rates from 1.25 Gbps to 16 Gbps.

Efinix Ti375 FPGAs include a hardened MIPI D-PHY, which you can use with MIPI CSI-2 and DSI controller IP cores to create multi-camera, high definition vision systems, edge computing, and hardware acceleration systems. Additionally, these FPGAs have a hardened DDR DRAM controller block that supports the LPDDR4/4x DRAM interface.

Features

  • 3300Mbps LPDDR4/4x Interface
  • Quad 16Gbps High Speed SerDes
  • PCIe Gen 4x4 Controller for Root Complex and End Point
  • 2.5Gbps MIPI D-Phy Lanes both Rx and Tx
  • Quad Core RISC-V processor complex at 1GHz Clock rate

Applications

  • PCIe cards
  • RF repeaters and radio units
  • Small cell/massive MIMO
  • Cable modems
  • Machine vision
  • Automotive
  • AV equipment and broadcast
  • Medical imaging
  • Video bridges

Ti375 Packages

N484
(18 x 18 mm, 0.8 pitch)

Efinix — Ti375 Packages: N484

C529
(19 x 19 mm, 0.8 pitch)

Efinix — Ti375 Packages: C529

N1156
(35 x 35 mm, 1 pitch)

Efinix — Ti375 Packages: N1156

Dimensions and blocks shown for illustrative purposes.

 

EK-RA4L1 Evaluation Kit

The Ti375 is available on two different development kits to speed time to market.

Ti375 in a 529 Ball FBGA

Features

  • 8Gbit LPDDR4
  • Gigabit Ethernet
  • FMC, two QSE and three PMOD Expansion slots
  • Micro-SD and USB Type C Connectors

 

PCIe Add-In Card

Features

  • Four SFP+ Connectors for 16Gbps SerDes
  • Two FMC and four QSE Expansion connectors
  • RJ45 Connector for Gigabit Ethernet
  • 16Gbit LPDDR4

The second kit takes the form of a PCIe add-in card for users wanting to exploit the high speed SerDes and PCIe capabilities.