
Référence fabricant
MCP42010-I/SL
DIGITAL POT, 256 STEPS, SPI, 10KOHMS, DUAL CHANNEL
Microchip MCP42010-I/SL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Microchip MCP42010-I/SL - Caractéristiques techniques
No of Positions: | 256 |
No of Channels: | 2 |
Interface: | SPI |
Wiper Storage: | Volatile |
Resistance: | 10kΩ |
Tolerance: | ±20% |
Supply Voltage: | 2.7V to 5.5V |
Supply Current: | 500µA |
Operating Temp Range: | -40°C to +85°C |
Resolution: | 8b |
Wiper Resistance: | 125Ω |
Style d'emballage : | SOIC-14 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
57 par Tube
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount