Manufacturer Part #
DSC1123NI1-100.0000T
100 MHz XO (Standard) LVDS Oscillator 2.25V 3.63V Enable/Disable 6-VDFN
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Cut Tape | ||||||||||
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Microchip DSC1123NI1-100.0000T - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:April 15, 2021: Issued initial notification.April 07, 2022: Issued the final notification. Adjusted the timetable summary and included the estimated first ship date on April 30, 2022. Attached the qualification report.Description of Change:Qualification of a new lead frame with Full PPF die attach paddle (DAP) surface prep material for DSC11xx, DSC12xx and DSC81xx device families available in 6L VDFN (7x5x0.9mm) package at NSEB assembly site.Pre and Post Change Summary: see attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying a new lead frame with Full PPF die attach paddle (DAP) surface prep material. Change Implementation Status:In ProgressEstimated First Ship Date:April 30, 2022 (date code: 2218)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Microchip has released a new Product Documents for the DSC11xx Family Silicon Errata of devices. Notification Status: FinalDescription of Change: Initial release of this document.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 03 Nov 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
PCN Status: Initial notification PCN Type: Manufacturing ChangeDescription of Change:Qualification of STAR as an additional assembly site for selected DSC812xxx, DSC110xxx, and DSC112xxx device families available in 6L VDFN (7x5x0.9mm) package.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying STAR as an additional assembly siteChange Implementation Status:In ProgressEstimated Qualification Completion Date:December 2021
PCN Status: Initial notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of a new lead frame with Full PPF die attach paddle (DAP) surface prep material for DSC11xx, DSC12xx and DSC81xx device families available in 6L VDFN (7x5x0.9mm) package at NSEB assembly site.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying a new lead frame with Full PPF die attach paddle (DAP) surface prep material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2021
Pre Change: With top mark DCPYYWW at the 2nd line marking. Post Change:With top mark DCPYYWW or DAPYYW at the 2nd line marking.Reason for Change: To improve manufacturability and traceability by implementing top marking changes for DSCxxx and DSAxxx products available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Change Implementation Status:In ProgressEstimated First Ship Date: November 19, 2020 (date code: 2047)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Available Packaging
Package Qty:
1000 per Cut Tape