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Référence fabricant
MCP79411T-I/MNY
MCP79411 Series 5.5 V I2C 2-Wire Serial Real-Time Clock/Calendar - TDFN-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :TDFN-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2317 | ||||||||||
Microchip MCP79411T-I/MNY - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the MCP79410/11/12 - Battery-Backed I2C Real-Time Clock/Calendar with SRAM, EEPROM and Protected EEPROM of devices. If you are using one of these devices please read the document located at MCP79410/11/12 - Battery-Backed I2C Real-Time Clock/Calendar with SRAM, EEPROM and Protected EEPROM.Data Sheet - MCP79410/11/12 - Battery-Backed I2C Real-Time Clock/Calendar with SRAM, EEPROM and Protected EEPROMNotification Status: FinalDescription of Change: Replaced “Master” and “Slave” terminology with “Host” and “Client” respectively. Updated MSOP package marking information.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Oct 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
PCN Status:Final NotificationDescription of Change:Qualification of MMT as an additional assembly site for selected 11LCxx, 11AAxx, 24LCxx, 24AAxx, 24C0xx, 24VLxx, 34AAxx, 34LCxx, 34VLxx and MCP794xxx device families available in 8L TDFN (2x3x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:September 15, 2023
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Statut du produit:
Microchip MCP79411T-I/MNY - Caractéristiques techniques
| Date Format: | DW:DM:M:Y |
| Time Format: | HH:MM:SS |
| Interface: | I2C |
| Non-Volatile Memory Size: | 64B |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Temperature Grade: | Industrial |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Style d'emballage : | TDFN-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
TDFN-8
Méthode de montage :
Surface Mount