Référence fabricant
25LC640AT-E/ST
Microchip 25LC640AT-E/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
2500 par Std. Mfr. Pkg