Référence fabricant
MCP23S09T-E/MG
MCP23S09 Series SPI I/O EXPANDER - QFN-16
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel Style d'emballage :QFN-16 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP23S09T-E/MG - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the MCP23009/MCP23S09 - 8-Bit I/O Expander with Open-Drain Outputs Data Sheet of devices.Description of Change:Added information about the Automotive Qualification status of the device in Section �Features�.Clarified Section 3.1 �Package Marking Information� to more closely match manufacturing standards.Updated Section �Product Identification System�, with Automotive Qualified devices.Minor text and format changes throughout.
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Microchip MCP23S09T-E/MG - Caractéristiques techniques
| Supply Current-Max: | 1mA |
| Supply Voltage-Max: | 5.5V |
| Operating Temp Range: | -40°C to +125°C |
| Style d'emballage : | QFN-16 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel
Style d'emballage :
QFN-16
Méthode de montage :
Surface Mount