Manufacturer Part #
MCP6241-E/MC
MCP6241 Series 5.5 V 550 kHz Rail-to-Rail I/O Operational Amplifier - DFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:150 per Tube Package Style:DFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6241-E/MC - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change:Qualification of MMT as an additional assembly site for selected MCP6031, MCP6033, MCP6002, MCP6231 and MCP6241 device families available in 8L DFN (2x3x0.9mm) package.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:October 01, 2021 (date code: 2140)
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Microchip MCP6241-E/MC - Technical Attributes
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.3V/µs |
| Input Offset Voltage-Max: | 7mV |
| Gain Bandwidth Product: | 550kHz |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.8V to 5.5V |
| Common Mode Rejection Ratio: | 75dB |
| Supply Current: | 50µA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 83dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 110dB |
| Phase Margin: | 68° |
| Low Noise: | 45nV/√Hz |
| Output Current: | 23mA |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6241-E/MC is a part of MCP6241 Series Operational Amplifier. It can sustain a standard temperature ranging from -40 to 125°C It comes in 8 pin DFN package.
MCP6241 operational amplifier (Op Amp) provides wide bandwidth for the quiescent current. It has a 550 kHz Gain Bandwidth Product (GBWP) and 68° (typ.) phase margin. This op amp operates from a single supply voltage as low as 1.8 V, while drawing 50 µA (typ.) quiescent current.
Features:
- Gain Bandwidth Product: 550 kHz (typical)
- Supply Current: IQ = 50 μA (typical)
- Supply Voltage: 1.8 V to 5.5 V
- Rail-to-Rail Input/Output
- Extended Temperature Range: -40°C to +125°C
- Available in 5-Pin SC70 and SOT-23 packages
Application:
- Automotive
- Portable Equipment
- Transimpedance amplifiers
- Analog Filters
- Notebooks and PDAs
- Battery-Powered Systems
Available Packaging
Package Qty:
150 per Tube
Package Style:
DFN-8
Mounting Method:
Surface Mount
