FTM / Embedded Processing and Software / Diodes Incorporated — PI7C9X3G816GP Packet Switch
The new PI7C9X3G816GP PCIe® 3.0 packet switch from Diodes Incorporated supports 16 lanes of PCIe 3.0 SERDES communication in flexible two-, three-, four-, five-, and eight-port configurations.
The PI7C9X3G816GP architecture allows for flexible port configuration. It can be configured to have multiple port/lane width combinations, such as upstream, downstream, and cross-domain end-point, to support fan-out and dual-host connectivity.
An integrated PCIe 3.0 clock buffer reduces overall component count, eases product design-in, and helps to reduce bill-of-materials cost. The PI7C9X3G816GP supports three reference clock structures: common, separate reference no spread, and separate reference independent spread.
Multiple DMA channels are embedded into the switch to facilitate efficient communication between the host, or hosts, and connected end-points.
A built-in thermal sensor reports operating temperature instantly. Advanced power management means that the PI7C9X3G816GP is compatible with the most stringent energy-saving requirements for greener data centers. For instance, the packet switch supports seven power-management states, and any inactive hot-pluggable ports are kept in a low-power state.
Advanced diagnostic software tools, including PHY Eye™, MAC Viewer™, and PCIBUDDY™ assist designers throughout system development.
PCI Express®, PCIe®, PCI-SIG®, and PCI™ are trademarks or registered trademarks and/or service marks of PCI-SIG Corporation.
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