Infineon — CYW5551x Wi-Fi_Bluetooth Communications Devices

The reliable, high-performance AIROC CYW5551x chipsets from Infineon combine Wi-Fi and Bluetooth wireless connectivity in a single chip. The introduction of the CYW5551x brings to the embedded market Wi-Fi capabilities which go beyond the Wi-Fi 6/6E standard to provide high-speed data transfers and connectivity for congested networks in IoT, smart home and wearable device applications. 

The CYW55513 chipset will be available for ordering by distribution customers in the Type 2FY surface-mount module from Murata. The high-performance LBEE5HY2FY-922 module is supplied in a very small package which facilitates integration into size- and power-sensitive applications, including industrial applications operating at temperatures up to 85°C. 

This new AIROC family of 1 x 1 antenna, single-stream wireless transceivers consists of the tri-band 2.4 GHz/5 GHz/6 GHz CYW55513, the dual-band CYW55512, and the single-band CYW55511. All three chips provide an IEEE 802.11ax-compliant Wi-Fi 6/6E media access controller, baseband and radio, alongside a Bluetooth/Bluetooth Low Energy (LE) v5.4 radio sub-system. 

Bluetooth system control is performed by a 192 MHz Arm® Cortex®-M33 processor. The chips support Bluetooth Classic and Bluetooth LE functions running in hosted/controller mode, or in the embedded mode in which the chip relieves the host processor of the burden of running Bluetooth control functions.  

The CYW5551x supports various Bluetooth features including LE Audio, LE2 data transfers at 2 Mbits/s, LE1 at 1 Mbit/s, Bluetooth Low Energy long-range (LR) mode, and periodic advertising extensions.