Référence fabricant
PVI5033RS-TPBF
PVI5033R Series 10 V 5 uA 40 mA 2 Channel Photovoltaic Isolator SMT - DIP-8
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :750 par Reel Style d'emballage :DIP-8 Méthode de montage :Surface Mount | ||||||||||
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Infineon PVI5033RS-TPBF - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Change of wafer production from Infineon Technologies Americas Corp., Temecula CA., USA to Silicon Foundry EPISIL Technologies Inc., Hsinchu, Taiwan for PVG Gen 2 and Gen 3, MOSFET G5 and IGBT G4 wafers, and MOSFET G7.5 wafers to Silicon Foundry Sichuan Gen Microelectronics co.Ltd, Suining,China.The wafer production of the affected products will be transferred to Silicon Foundry EPISIL Technologies Inc., Hsinchu, Taiwan, according to the global Infineon production strategy.
Statut du produit:
Infineon PVI5033RS-TPBF - Caractéristiques techniques
| No of Channels: | 2 |
| Isolation Voltage-RMS: | 3750V |
| Output Voltage-Max: | 10V |
| Operating Temp-Max: | 85°C |
| Style d'emballage : | DIP-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
This device is ideally suited for applications requiring high-current and/or high-voltage switching with optical isolation between the low-level driving circuitry and high-energy or high-voltage load circuits. It utilizes a monolithic integrated circuit photovoltaic generator of novel construction as its output.
Features:
- Monolithic construction
- 3750 VRMS I/O isolation
- 1200 VDC output-to-output isolation
- Dual channel application flexibility
- Solid state reliability
Applications:
- Telecommunications
- Load distribution
- Industrial controls
- Instrumentation and measurement
- Electronic ballast
Emballages disponibles
Qté d'emballage(s) :
750 par Reel
Style d'emballage :
DIP-8
Méthode de montage :
Surface Mount