Référence fabricant
IFX007TAUMA1
IFX007T Series 40 V 55 A SMT Half Bridge Integrated Driver - PG-TO263-7-1
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Reel Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2437 | ||||||||||
Infineon IFX007TAUMA1 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Detailed change information Subject: Several changes affecting product IFX007T Reason/Motivation: Due to continuously raising demand for Infineon automotive products exceeding the capacity in wafer fab Regensburg and Villach, the following production strategy will be implemented for the product.The wafer production of SPT5 will be transferred from Regensburg to Kulim.The wafer production of SFET4 will be transferred from Villach to Kulim.Change of wafer diameter for PFET4 from 200mm to 300mm at wafer fab Villach.
Statut du produit:
Infineon IFX007TAUMA1 - Caractéristiques techniques
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Infineon’s NovalithIC™ IFX007T is a half-bridge with integrated driver IC for use in industrial, consumer and other types of brushed and brushless motor drives. It provides a cost- and space-optimized solution for high-current PWM motor drives while offering comprehensive protection against system faults.
APPLICATIONS
• Automation equipment
• Home appliances
• Robotics
• Medical equipment
• Power tools
• Drones
• 3D printers
• Fans
• Pumps
FEATURES
• 50A maximum continuous drain current
• 24V normal operating voltage
• 40V maximum operating voltage
• 12.8mΩ maximum on-resistance at 25°C
• Supports PWM frequency up to 20kHz
• Operating-temperature range: -40°C to 150°C
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Méthode de montage :
Surface Mount