Référence fabricant
24LC32AT-E/MC
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel | ||||||||||
| Code de date: | |||||||||||
Microchip 24LC32AT-E/MC - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Product Documents for the 24AA32A/24LC32A 32-Kbit I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change:1.Updated formatting to current template.2.Replaced terminology �Master� and �Slave� with �Host� and �Client� respectively.3.Removed CSP product offering.4. Added Automotive Product Identification System.5. Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 23 Nov 2021
Microchip has released a new Product Documents for the 24AA32A/24LC32A 32-Kbit I2C Serial EEPROM Data Sheet of devices.Description of Change:1.Updated formatting to current template.2.Replaced terminology �Master� and �Slave� with �Host� and �Client� respectively.3.Removed CSP product offering.4. Added Automotive Product Identification System.5. Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings. Reason for Change: To Improve Productivity Date Document Changes Effective: 23 Nov 2021
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
CCB 1474 Initial Notice: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Description of Change: Qualification of C194 lead-frame for 8L DFN (2x3x0.9mm) and 8L DFN-S (6x5x0.9mm) packages at NSEB.Pre Change: EFTEC-64T lead-framePost Change: EFTEC-64T or C194 lead-frameReason for Change: To improve on-time delivery performance by qualifying an additional lead frame materialNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel