Référence fabricant
11AA010-I/TO
Microchip 11AA010-I/TO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the 11AAXXX-1-Kbit to 16-Kbit UNI/O Serial EEPROM Family Data Sheet of devices. Description of Change:Updated formatting to current template; Replaced terminology �Master� and �Slave� with �Host� and �Client� respectively; Added Automotive PISReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 21 March 2023
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of CEL-8240 GS as a new mold compound and 84-1 LIMIS R4 die attach material for selected 11AAxxx and 11LCxxx device families available in 3L TO-92 package assembled at CRTK assembly site.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity and on-time delivery performance by qualifying CEL-8240 GS as a new mold compound and 84-1 LIMIS R4 die attach material at CRTK assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:April 8, 2022 (date code: 2215)
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of CEL-8240 GS as a new mold compound and 84-1 LIMIS R4 die attach material for selected 11AAxxx and 11LCxxx device families available in 3L TO-92 package assembled at CRTK assembly site.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity and on-time delivery performance by qualifying CEL-8240 GS as a new mold compound and 84-1 LIMIS R4 die attach material at CRTK assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:February 2022
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
1000 par Std. Mfr. Pkg