Manufacturer Part #
PVI5033RS-TPBF
PVI5033R Series 10 V 5 uA 40 mA 2 Channel Photovoltaic Isolator SMT - DIP-8
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:750 per Reel Package Style:DIP-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Infineon PVI5033RS-TPBF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Change of wafer production from Infineon Technologies Americas Corp., Temecula CA., USA to Silicon Foundry EPISIL Technologies Inc., Hsinchu, Taiwan for PVG Gen 2 and Gen 3, MOSFET G5 and IGBT G4 wafers, and MOSFET G7.5 wafers to Silicon Foundry Sichuan Gen Microelectronics co.Ltd, Suining,China.The wafer production of the affected products will be transferred to Silicon Foundry EPISIL Technologies Inc., Hsinchu, Taiwan, according to the global Infineon production strategy.
Part Status:
Infineon PVI5033RS-TPBF - Technical Attributes
| No of Channels: | 2 |
| Isolation Voltage-RMS: | 3750V |
| Output Voltage-Max: | 10V |
| Operating Temp-Max: | 85°C |
| Package Style: | DIP-8 |
| Mounting Method: | Surface Mount |
Features & Applications
This device is ideally suited for applications requiring high-current and/or high-voltage switching with optical isolation between the low-level driving circuitry and high-energy or high-voltage load circuits. It utilizes a monolithic integrated circuit photovoltaic generator of novel construction as its output.
Features:
- Monolithic construction
- 3750 VRMS I/O isolation
- 1200 VDC output-to-output isolation
- Dual channel application flexibility
- Solid state reliability
Applications:
- Telecommunications
- Load distribution
- Industrial controls
- Instrumentation and measurement
- Electronic ballast
Available Packaging
Package Qty:
750 per Reel
Package Style:
DIP-8
Mounting Method:
Surface Mount