Manufacturer Part #
93LC56B-I/ST
93LC56 Series 2 Kbit (128 x 16) 5.5 V Microwire Compatible Serial EEPROM-TSSOP-8
Microchip 93LC56B-I/ST - Product Specification
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Microchip has released a new Datasheet for the 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C - 2-Kbit Microwire Compatible Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C - 2-Kbit Microwire Compatible Serial EEPROM Data Sheet.Description of Change:Corrected �1st Line Marking Codes� table.Reason for Change: To improve Productivity.
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Part Status:
Microchip 93LC56B-I/ST - Technical Attributes
Memory Density: | 2kb |
Memory Organization: | 128 x 16 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Clock Frequency-Max: | 2MHz |
Write Cycle Time-Max (tWC): | 6ms |
Package Style: | TSSOP-8 |
Mounting Method: | Surface Mount |
Features & Applications
The 93XX56A/B/C devices are 2 Kbit low-voltage serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93AA56C, 93LC56C or 93C56C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX56A devices are available, while the 93XX56B devices provide dedicated 16-bit communication.
Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN and 8-lead TSSOP. All packages are Pb-free (Matte Tin) finish.
Features:
- Low-Power CMOS Technology
- ORG Pin to Select Word Size for ‘56C’ Version
- 256 x 8-bit Organization ‘A’ Version (no ORG)
- 128 x 16-bit Organization ‘B’ Version (no ORG)
- Self-Timed Erase/Write Cycles (including Auto-Erase)
- Automatic Erase All (ERAL) before Write All (WRAL)
- Power-On/Off Data Protection Circuitry
- Industry Standard 3-Wire Serial I/O
- Device Status Signal [Ready/Busy(bar)]
- Sequential Read Function
- 1,000,000 Erase/write Cycles
- Data Retention > 200 Years
- Pb-free and RoHS Compliant
- Temperature ranges supported:
Available Packaging
Package Qty:
100 per Std. Mfr. Pkg
Package Style:
TSSOP-8
Mounting Method:
Surface Mount