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Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Learn 4 different ways to read the Panasonic GridEye sensor on the Compagno Board, a prototyping and testing platform for industrial IoT applications such as condition monitoring and predictive maintenance.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
In this episode of TechVentures, find out how to use Microchip’s Certified Bluetooth 5.0 module and Melexis IR thermal sensor to design a connected digital thermometer.
Microchip has a reference design to support the development of a low-cost digital thermometer, which can be handheld or integrated into a wearable device. The main components are a Microchip microcontroller, the PIC16F1519 MCU, a cost-effective 8-bit microcontroller with an integrated capacitive touch sensing module.
Melexis’ non-contact medical infrared sensor is also used in the design, which is great for thermally dynamic environments and when available space is limited. Melexis offers this part for commercial and medical applications.
Temperature measurement has become increasingly important. Using a thermistor or an infrared thermal sensor is paramount for digital thermometers requiring contact, such as at home or for personal use.
Medical device designers need an experienced semiconductor solutions supplier with a medical focus to help meet the demands of the current market. Our suppliers such as Microchip and Melexis are well known in the industry for helping our medical customers get to market faster with robust medical device designs.
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