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Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Learn 4 different ways to read the Panasonic GridEye sensor on the Compagno Board, a prototyping and testing platform for industrial IoT applications such as condition monitoring and predictive maintenance.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Each edition is packed with new product information, application notes, detailed technical analysis and commentary from Future Electronics’ Advanced Engineers, supplier partners and other industry experts.
Using the amazing capabilities of image sensing, adding machine vision to your design project is a walk in the park.
In this episode of TechVentures with Lazina, explore the Future Electronics Cyclops converter board, a simple platform our host will use to show you how to add a camera module to an embedded system design or proof of concept.
Geared to speed up prototyping for image processing, the Cyclops board uses onsemi’s CMOS image sensor to demonstrate those capabilities.
Cyclops is a converter board designed by Future Electronics System Design Center, made to be an easy evaluation platform for image processing applications such as bar code scanning, machine vision, gesture recognition and biometrics.
The reason behind the Cyclops board: The onsemi AR0144 CMOS image sensor!
The AR0144 is a 1/4-inch 1.0 Mp CMOS digital image sensor with an active-pixel array of 1280H x 800V. It incorporates a new innovative global shutter pixel design optimized for accurate and fast capture of moving scenes.
The FM10FF-724H is a camera module using onsemi AR0144CSSM image sensor, offering 150° Diagonal field of View, ¼ inch optical format, with 1 Mp Global shutter resolution. Prototypes are supported by onsemi part number IAS1MOD-AR0144CSSM090110-GEVB which allows for easy development. Part of the IAS module family from onsemi, the module includes standardized connectors, layout configuration and OTPM protocols.
With the AR0144CSSM CMOS image sensor, big field of view mono imaging is achieved for applications including robotics, machine vision, AR/VR/MR and artificial intelligence. The innovative global shutter pixel design is optimized for accurate and fast capture of moving scenes.
The sensor produces clear, low noise images in both low-light and bright scenes. It includes sophisticated camera functions such as auto exposure control, windowing, row skip mode, column-skip mode, pixel-binning and both video and single frame modes. It is programmable through a simple two-wire serial interface.
The AR0144CS produces extraordinarily clear, sharp digital pictures, and its ability to capture both continuous video and single frames makes it the perfect choice for a wide range of applications.
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