Tech Day Events: Seattle - Future Electronics Blog

Future Tech Day: Pacific NW

Driving Innovation in Power & Connectivity

October 11th, 2023 – Seattle, WA

To see where the next Future Tech Day event will be held click here

Event Overview

Join us in exploring the latest Technologies and Innovations in Power and Connectivity. Discover Innovation in design and manufacturing. You will have access to semiconductor industry experts, specialists in their respected fields.

The Future Electronics teams are excited to share, in collaboration with our supplier partners, new innovative technologies across Power / Analog, Wireless, FPGA, Sensor, Interconnect and emerging design implementations..

This Future Tech Day will give you FREE access to:

All Day Supplier Expo with 40 booths of industry leaders and new technology innovators.
15 classes are available through registration to hear presentations from industry experts, specialists and product marketers.
Keynote from Future Electronics guest customer, Fluke Corporation and teams will discuss their collaboration with customers that led to safety innovations in electrical testing. Award Winning T6-1000 will be on display.

Location

Lynnwood Event Center
3711 196th St SW
Lynnwood, WA, 98036

Course Descriptions

Click to toggle descriptions and learn more. Find the sessions that interest you and save your spot for them in the form at the bottom of the page.

STMicroelectronics – Securing your connectivity

Connecting smart home devices has always been a challenge with different devices from different manufacturers. Matter is the simplification of the connectivity standards making it easy for consumers to connect all of their devices and enable seamless compatibility.

STMicroelectronics is fully committed to supporting Matter and the STM32WB5x devices enable this connectivity. Bluetooth LE connectivity is becoming more common as the world becomes more connected.

To meet the needs of IoT device manufacturers and their customers, ultra-low power consumption and advanced security are essential, with SESIP certification often being a requirement. Discover the STM32WBA52 Wireless SoC that excels at these requirements for your wireless design.

Vishay – Power Conversion Solutions

Review Vishay’s advanced portfolio of MOSFETs, Diodes and IC’s and understand common power applications with a cost-effective approach. Come see our newest products and ask how we can help you. “Think Customers First” Vishay’s new branding.

KYOCERA AVX – Innovative Connectors for Today's Applications

This presentation will explore the integration of 5G and Internet of Things (IoT). KAVX will delve into cutting-edge solutions that bridge the gap between these advancements, addressing the connectivity demands of modern applications.

Infineon – The SPIRIT of Infineon

Infineon is doing exciting new things in the arena of industrial processors and various sensors following their completed merger with Cypress Semi. These combine with our historical strength in power to provide full solutions in silicon, SiC, & GAN FETS and drivers. We also cover memory and automotive products to complete the full suite of options for designers.

u-blox – Can you help me find??? Utilizing u-blox Connectivity and Location solutions

Utilizing u-blox technology to connect and locate assets.

Amphenol FCI – Power Solutions: Energy and Mobility

Overview of power products commonly found in e-mobility and energy verticals with a review of Amphenol capabilities and success stories.

Renesas – Renesas “Renaissance” ARM MCU, MPU, TinyML, Edge AI Portfolio Overview with More Than 70 NPIs

Renesas is leading ARM, TinyML, and Edge AI innovation with more than 70 RA and RZ product family NPIs in the last three years. The RA family scales from M23 to the industry’s first M85 core featuring Reality AI® real-time analytics software utilizing the lowest processing and memory footprint on an ARM CPU core; The RZ Family features the A55 + Renesas’ efficient AI core scaling from 0.5 TOPS to 80 TOPS of heatsink-less AI acceleration.

Renesas has been able to reliably deliver MCUs and MPUs with 12-week lead times backed by a dual sourced production method even during the industry’s most supply constrained times; Renesas now ranks #1 in overall 2022 MCU market share. Come meet our new local factory team of 8 sales and FAE resources all here in Southern California available to support you.

Power Integrations – High-Efficiency AC-DC GaN Solutions

On this session, we will go into the world’s most advanced and highest volume GaN devices in production. Company experts will showcase the Power Integrations’ PowiGaN products and explain how GaN switches will dominate high voltage power conversion. There are 11 families that incorporate PowiGaN switches. These include the InnoSwitch3 and InnoSwitch4 flyback switchers, LYTSwitch-6 LED driver, HiperPFS-5 power factor correction controller IC with integrated switch, and MinE-CAP bulk capacitor miniaturization IC families – with more families coming soon.

This session aims to bring the audience to a new level of understanding about possibilities revealed by PowiGaN switches – from the latest target applications to device operation, evaluation and design advantages. Take away the confidence to design with reliable and robust GaN for your application, backed with the tools and support needed to make your winning solution a success.

Hirose Electric – The Continuing Evolution of Connector Technology Across Converging Segments

With technology across industries becoming smaller, and with increasing power and data demands being placed on the electrical design of products, we at Hirose are seeing the merging of connector technology across business segments. Hirose will explore the overlap of these industries and how connectivity solutions are adapting.

onsemi – High Power & Power Management

Discuss EliteSiC Silicon Carbide technology and the advantages of using onsemi, how to pair SiC with gate drivers to sell the entire onsemi solution, and other power management products for high power designs.

Laird Connectivity – Wi-Fi 6/6E in Embedded: All You Need to Know to Get Started Successfully

More and more Wi-Fi-enabled devices are competing for limited bandwidth and pushing the WLAN infrastructure to its limits. This is where Wi-Fi 6 delivers a giant leap forward for connectivity in embedded applications like medical, industrial and logistics.

With Wi-Fi 6 your data bandwidth can be super-fast at 9.6 Gbps, almost as if it were in real time. Connecting many devices simultaneously now works more reliably and efficiently, even in close proximity. New features for lower power consumption enable new, portable applications.

In this presentation, you will learn how to add significant value to your devices with Wi-Fi 6.

CviLux – Connect the World. Connect the Future.

In this session, Matt Cordell, GM of CviLux North America, will discuss how CviLux is driving innovation in power and connectivity. He will showcase some of the latest innovations with USB technology and its impact in a variety of industries, such as medical, consumer electronics and aerospace, to name a few. Matt will also discuss the future of EV charging and CviLux’s exciting offerings in this space.

Abracon – Next Generation Magnetics: Focus on Power and EMI

Abracon takes pride in presenting an extensive array of power and magnetic products, tailored to cater to a diverse range of technical applications. This presentation brings a special focus to the power and EMI challenges of datacenter, automotive, and consumer electronic markets, where Abracon’s solutions hold significant value.

NXP – Tri-Radio Solutions (Wi-Fi+BT+802.15.4) and Coexistence

This session will provide a high-level introduction to NXP’s IW61x and newly announced RW61x Tri-Radio family of devices capable of communicating over Wi-Fi 6, Bluetooth and 802.15.4 supporting both Matter over Wi-Fi and Matter over Thread. In addition, this session will focus on the fundamentals of coexistence across these radio technologies, why it is critical for optimal system performance and what coexistence approach NXP has implemented on these devices.

Crocus – TMR Technology: Performance Without Compromise

Discover the game-changing potential of Tunnel Magnetoresistance (TMR) technology in the world of magnetic sensors. Explore TMR’s quantum mechanics and nanotechnology foundation, powering heightened sensitivity, efficiency, and accuracy.

Agenda

Time	Main Room
8:00 am to 8:45 am	Registration, Breakfast and Beverages
8:45 am to 9:00 am	Opening Remarks
9:00 am to 9:20 am	Keynote Speaker – Fluke Corporation, a guest customer of Future Electronics
9:30 am to 4:30 pm	Supplier Fair
10:00 am to 4:00 pm	Technology and Innovation Presentations. See agenda below
4:45 pm to 6:00 pm	Networking and Giveaways

Conference Room / Time	Room 2A	Room 2B	Room 2C
10:00 am to 10:45 am	STMicroelectronics – Securing your connectivity	Vishay – Power Conversion Solutions	KYOCERA AVX – Innovative Connectors for Today’s Applications
11:00 am to 11:45 am	Infineon – The SPIRIT of Infineon	u-blox – Can you help me find??? Utilizing u-blox Connectivity and Location solutions	Amphenol FCI – Power Solutions: Energy and Mobility
12:00 pm to 1:00 pm	Buffet Lunch
1:15 pm to 2:00 pm	Renesas – Renesas “Renaissance” ARM MCU, MPU, TinyML, Edge AI Portfolio Overview with More Than 70 NPIs	Power Integrations – High-Efficiency AC-DC GaN Solutions	Hirose Electric – The Continuing Evolution of Connector Technology Across Converging Segments
2:15 pm to 3:00 pm	onsemi – High Power & Power Management	Laird Connectivity – Wi-Fi 6 / 6E in Embedded: All you need to know to get started successfully	CviLux – Connect the World. Connect the Future
3:15 pm to 4:00 pm	NXP – Tri-Radio Solutions (Wi-Fi+BT+802.15.4) and Coexistence	Abracon – Next Generation Magnetics: Focus on Power and EMI	Crocus – TMR Technology, Performance Without Compromise
4:45 pm to 6:00 pm	*Networking and Giveaways*