Overview of power products commonly found in e-mobility and energy verticals with a review of Amphenol capabilities and success stories. 

Renesas is leading ARM, TinyML, and Edge AI innovation with more than 70 RA and RZ product family NPIs in the last three years. The RA family scales from M23 to the industry’s first M85 core featuring Reality AI® real-time analytics software utilizing the lowest processing and memory footprint on an ARM CPU core; The RZ Family features the A55 + Renesas’ efficient AI core scaling from 0.5 TOPS to 80 TOPS of heatsink-less AI acceleration.  

Renesas has been able to reliably deliver MCUs and MPUs with 12-week lead times backed by a dual sourced production method even during the industry’s most supply constrained times; Renesas now ranks #1 in overall 2022 MCU market share. Come meet our new local factory team of 8 sales and FAE resources all here in Southern California available to support you.  

On this session, we will go into the world’s most advanced and highest volume GaN devices in production. Company experts will showcase the Power Integrations’ PowiGaN products and explain how GaN switches will dominate high voltage power conversion. There are 11 families that incorporate PowiGaN switches. These include the InnoSwitch3 and InnoSwitch4 flyback switchers, LYTSwitch-6 LED driver, HiperPFS-5 power factor correction controller IC with integrated switch, and MinE-CAP bulk capacitor miniaturization IC families – with more families coming soon.   

This session aims to bring the audience to a new level of understanding about possibilities revealed by PowiGaN switches – from the latest target applications to device operation, evaluation and design advantages.  Take away the confidence to design with reliable and robust GaN for your application, backed with the tools and support needed to make your winning solution a success.  

With technology across industries becoming smaller, and with increasing power and data demands being placed on the electrical design of products, we at Hirose are seeing the merging of connector technology across business segments.  Hirose will explore the overlap of these industries and how connectivity solutions are adapting. 

Discuss EliteSiC Silicon Carbide technology and the advantages of using onsemi, how to pair SiC with gate drivers to sell the entire onsemi solution, and other power management products for high power designs.