Contactless temperature measurement and thermal imager in Arduino-compatible shield format
Future Electronics’ design features the latest thermal sensor array from Melexis, a crossover MCU from NXP and a reliable Tianma display.
The Sequana-Thermal board designed by Future Electronics combines a far-field infrared thermal sensor array, the MLX90640 from Melexis, and a PaPIR infrared proximity sensor from Panasonic. It is supplied in an Arduino-compatible shield format.
It connects to an NXP Semiconductors i.MX RT1050/i.MX RT1060 processor running software which
demonstrates a thermal imaging application displayed on a 4.3″ Tianma LCD screen.
The Sequana-Thermal software bundle runs on the i.MX RT1050/i.MX RT1060, a crossover 600MHz Arm®
Cortex®-M7 chip, combining the high-speed processing capability of an applications processor with the integration and usability of a microcontroller.
The Sequana-Thermal software bundle includes:
• Arm® MBED™ operating system which provides comprehensive connectivity and security functions as well as system
management
• Low level software – sensor drivers for the MLX90640 and PaPIR; display driver for the Tianma 4.3″ display
• Integrated libraries for people detection
APPLY FOR A FREE SEQUANA ENVIRONMENTAL SHIELD BOARD
Sequana-Thermal development boards are supplied free-of-charge to pre-qualified customers of Future Electronics.
To apply for your board, contact your local branch or visit: www.my-boardclub.com.
